XDFN4 Package Electronic Component Models from TI and Toshiba
About this design
Detailed CAD models of XDFN4 package electronic components including DQN0004A by Texas Instruments and DFN4F by Toshiba, created from official datasheets for precise engineering use.
The files are shared to help you get inspired and speed up your workflow. They may not be fully accurate or production-ready, so review carefully before use.
| View Name | Extension | Action |
|---|---|---|
| Design file | step | |
| Front View | webp | |
| Top View | webp | |
| Bottom View | webp | |
| Left Side View | webp | |
| Right Side View | webp | |
| Isometric View | webp |
| File Name | Action |
|---|---|
| No supporting files | |
About CAD
The CAD model comprises 65 faces, 151 edges, 99 vertices, 6 solids. Surface types include 58 planar, 6 cylindrical, 1 toroidal. Orientations: 21 along the X-axis, 19 along the Y-axis, 25 along the Z-axis. Model dimensions: 1.02 mm wide, 1.00 mm high, 0.40 mm deep. Volumetric data: maximum volume of 0.38 mm³, minimum volume of 0.00 mm³, average volume of 0.07 mm³, total volume of 0.42 mm³
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Supported formats: STEP (.step, .stp), IGES (.igs, .iges), STL (.stl), PLY (.ply), OFF (.off), BREP (.brp, .brep)
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