Leg Options for TO-247-3 and TO-247-2 Semiconductor Packages
About this design
Detailed configurations of leg options designed for TO-247-3 and TO-247-2 semiconductor packages, suitable for electronic component integration and thermal management.
The files are shared to help you get inspired and speed up your workflow. They may not be fully accurate or production-ready, so review carefully before use.
| View Name | Extension | Action |
|---|---|---|
| Design file | step | |
| Front View | webp | |
| Top View | webp | |
| Bottom View | webp | |
| Left Side View | webp | |
| Right Side View | webp | |
| Isometric View | webp |
| File Name | Action |
|---|---|
| No supporting files | |
About CAD
The CAD model comprises 83 faces, 224 edges, 147 vertices, 4 solids. Surface types include 80 planar, 3 cylindrical. Orientations: 36 along the X-axis, 12 along the Y-axis, 35 along the Z-axis. Model dimensions: 15.90 mm wide, 5.02 mm high, 41.02 mm deep. Volumetric data: maximum volume of 1119.52 mm³, minimum volume of 17.70 mm³, average volume of 378.97 mm³, total volume of 1515.88 mm³
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