Compact Heat Sink for Audio Amplifiers TDA2050, TDA2030, TDA2003
About this design
Precision-engineered heat sink measuring 25mm x 36mm x 11mm designed to efficiently dissipate heat from audio amplifier ICs including TDA2050, TDA2030, and TDA2003 models.
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The files are shared to help you get inspired and speed up your workflow. They may not be fully accurate or production-ready, so review carefully before use.
| View Name | Extension | Action |
|---|---|---|
| Design file | Format: STEP | |
| Front View | webp | |
| Top View | webp | |
| Bottom View | webp | |
| Left Side View | webp | |
| Right Side View | webp | |
| Isometric View | webp |
| File Name | Action |
|---|---|
| No supporting files | |
CAD File Details
What you can use this CAD model for
- Engineering review
- Manufacturing discussion
- Supplier communication
- Prototype development
- Design validation
Before using this CAD file
Review the model dimensions, units and geometry before using it for manufacturing or production. Some files may be created for reference, visualization or workflow acceleration and may require validation before final use.
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