Compact Heat Sink for Audio Amplifiers TDA2050, TDA2030, TDA2003
About this design
Precision-engineered heat sink measuring 25mm x 36mm x 11mm designed to efficiently dissipate heat from audio amplifier ICs including TDA2050, TDA2030, and TDA2003 models.
The files are shared to help you get inspired and speed up your workflow. They may not be fully accurate or production-ready, so review carefully before use.
| View Name | Extension | Action |
|---|---|---|
| Design file | step | |
| Front View | webp | |
| Top View | webp | |
| Bottom View | webp | |
| Left Side View | webp | |
| Right Side View | webp | |
| Isometric View | webp |
| File Name | Action |
|---|---|
| No supporting files | |
About CAD
The CAD model comprises 327 faces, 905 edges, 590 vertices, 5 solids. Surface types include 151 planar, 154 cylindrical, 16 conical, 4 toroidal, 2 other surfaces. Orientations: 110 along the X-axis, 65 along the Y-axis, 152 along the Z-axis. Model dimensions: 36.00 mm wide, 29.32 mm high, 15.38 mm deep. Volumetric data: maximum volume of 3459.39 mm³, minimum volume of 8.64 mm³, average volume of 817.89 mm³, total volume of 4089.45 mm³
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